Shouxu Wang: шукати на сайті Z-Library

Найбільша колекція наукових статей у сіті. 70,000,000+ безкоштовних статей.

Пожертвування 15 вересня 2024 – 1 жовтня 2024

Z-Library - одна з найбільших онлайн-бібліотек у світі, в якій зберігається більше 17,000,000 книг та 84,837,000 статей. Ми намагаємось зробити літературу доступною кожному. Сьогодні (15 вересня 2024) ми відкриваємо додатковий збір пожертвувань на підтримку та розвиток проекту.

Також БЕЗЛІМТНІ завантаження (протягом 31 дня після завершення пожертвування) доступні для ВСІХ користувачів, які підтримають проект в період збору коштів до 1 жовтня 2024.

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Підтримати

Книги
Статті (92)
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A Novel Nitric Acid Etchant and Its Application in Manufacturing Fine Lines for PCBs

Guoyun Zhou, Wei He, Shouxu Wang, Yunqi Mo, Ke Hu, Bo He

Журнал:

IEEE Transactions on Electronics Packaging Manufacturing

Рік:

2010

Мова:

english

Файл:

PDF, 878 KB

english, 2010

Enhancing adhesion performance of sputtering Ti/Cu film on pretreated composite prepreg for stacking structure of IC substrates

Chen, Yuanming, Chen, Yunzhao, Wang, Jinzhong, Zhu, Kai, Jia, Liping, Wang, Shouxu, He, Wei, Chen, Qingguo, Miao, Hua, Zhou, Jinqun

Журнал:

Composites Part B: Engineering

Рік:

2019

Мова:

english

Файл:

PDF, 7.06 MB

english, 2019

Multi-objective optimal design of the nuclear reactor pressurizer

Liu, Zheng, Wang, Jianjun, Tan, Sichao, Qiao, Shouxu, Ding, Hu

Журнал:

International Journal of Advanced Nuclear Reactor Design and Technology

Рік:

2019

Файл:

PDF, 1.47 MB

2019

Plating Uniformity of Bottom-up Copper Pillars and Patterns for IC Substrates with Additive-assisted Electrodeposition

Chen, Yuanming, He, Wei, Chen, Xianming, Wang, Chong, Tao, Zhihua, Wang, Shouxu, Zhou, Guoyun, Moshrefi-Torbati, Mohamed

Журнал:

Electrochimica Acta

Рік:

2014

Мова:

english

Файл:

PDF, 2.41 MB

english, 2014

Preparation and properties of a novel electrically conductive adhesive using a composite of silver nanorods, silver nanoparticles, and modified epoxy resin

Xiaojian Yang, Wei He, Shouxu Wang, Guoyun Zhou, Yao Tang

Журнал:

Journal of Materials Science: Materials in Electronics

Рік:

2012

Мова:

english

Файл:

PDF, 519 KB

english, 2012

Study on brown oxidation process with imidazole group, mercapto group and heterocyclic compounds in printed circuit board industry

Wang, Chong, Xiang, Lin, Chen, Yuanming, Wang, Shouxu, Xiao, Dingjun, He, Wei

Журнал:

Journal of Adhesion Science and Technology

Рік:

2015

Мова:

english

Файл:

PDF, 619 KB

english, 2015

Improved Uniformity of Conformal Through-Hole Copper Electrodeposition by Revision of Plating Cell Configuration

Ji, Linxian, Wang, ShouXu, Wang, Chong, Chen, Guoqin, Chen, Yuanming, He, Wei, Tan, Ze

Журнал:

Journal of The Electrochemical Society

Рік:

2015

Мова:

english

Файл:

PDF, 1.31 MB

english, 2015

Fabrication of silver electrically conductive adhesive to apply in through-hole filling for PCB interconnection

Zhou, Guoyun, Mao, Yingjie, Wang, Chong, Wang, Shouxu, Chen, Yuanming, He, Wei

Журнал:

Journal of Materials Science: Materials in Electronics

Рік:

2016

Мова:

english

Файл:

PDF, 1.00 MB

english, 2016

Improving wettability of photo-resistive film surface with plasma surface modification for coplanar copper pillar plating of IC substrates

Xiang, Jing, Wang, Chong, Chen, Yuanming, Wang, Shouxu, Hong, Yan, Zhang, Huaiwu, Gong, Lijun, He, Wei

Журнал:

Applied Surface Science

Рік:

2017

Мова:

english

Файл:

PDF, 11.34 MB

english, 2017

[IEEE 2019 IEEE 4th International Conference on Advanced Robotics and Mechatronics (ICARM) - Toyonaka, Japan (2019.7.3-2019.7.5)] 2019 IEEE 4th International Conference on Advanced Robotics and Mechatronics (ICARM) - Learning From Actor-Critic Algorithm With Application to Asymmetric Tailored Performance Tracking Control of Underactuated Surface Vehicle

Mao, Ruiqi, Zhang, Shouxu, Wang, Yintao

Рік:

2019

Мова:

english

Файл:

PDF, 13.61 MB

english, 2019

Effect of the different shapes of silver particles in conductive ink on electrical performance and microstructure of the conductive tracks

Xiaojian Yang, Wei He, Shouxu Wang, Guoyun Zhou, Yao Tang, Juanhong Yang

Журнал:

Journal of Materials Science: Materials in Electronics

Рік:

2012

Мова:

english

Файл:

PDF, 576 KB

english, 2012

Erratum to: Effect of the different shapes of silver particles in conductive ink on electrical performance and microstructure of the conductive tracks

Xiaojian Yang, Wei He, Shouxu Wang, Guoyun Zhou, Yao Tang, Juanhong Yang

Журнал:

Journal of Materials Science: Materials in Electronics

Рік:

2012

Мова:

english

Файл:

PDF, 152 KB

english, 2012

Fabrication and performance characterization of Al/Ni multilayer energetic films

Cheng Yang, Yan Hu, Ruiqi Shen, Yinghua Ye, Shouxu Wang, Tianli Hua

Журнал:

Applied Physics A: Materials Science & Processing

Рік:

2014

Мова:

english

Файл:

PDF, 796 KB

english, 2014

A new approach causing the patterns fabricated by silver nanoparticles to be conductive without sintering

Tang, Yao, He, Wei, Zhou, Guoyun, Wang, Shouxu, Yang, Xiaojian, Tao, Zhihua, Zhou, Juncheng

Журнал:

Nanotechnology

Рік:

2012

Мова:

english

Файл:

PDF, 1020 KB

english, 2012

One step synthesis of silver nanowires used in preparation of conductive silver paste

Tang, Yao, He, Wei, Wang, Shouxu, Tao, Zhihua, Cheng, Lijuan

Журнал:

Journal of Materials Science: Materials in Electronics

Рік:

2014

Мова:

english

Файл:

PDF, 896 KB

english, 2014

[IEEE 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2011.10.19-2011.10.21)] 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Research on etching blind holes and desmear with plasma

Yu, Xiaofei, He, Wei, Wang, Shouxu, Zhou, Guoyun, Zhu, Meng

Рік:

2011

Мова:

english

Файл:

PDF, 892 KB

english, 2011

Incorporation of Tin on Copper Clad Laminate to Increase the Interface Adhesion for Signal Loss Reduction of High-frequency PCB Lamination

Wang, Chong, Wen, Na, Zhou, Guoyun, Wang, Shouxu, He, Wei, Su, Xinhong, Hu, Yongsuan

Журнал:

Applied Surface Science

Рік:

2017

Мова:

english

Файл:

PDF, 1.11 MB

english, 2017

Enhancing adhesion performance of no-flow prepreg to form multilayer structure of printed circuit boards with plasma-induced surface modification

Chen, Yuanming, Gao, Qingyao, He, Xuemei, Zhu, Kai, Wang, Shouxu, Wang, Chong, He, Wei, Zhou, Guoyun, Zhang, Huaiwu

Журнал:

Surface and Coatings Technology

Рік:

2018

Мова:

english

Файл:

PDF, 1.43 MB

english, 2018

Enhancing inductance of spiral copper inductor with BaFe 12 O 19 /poly (phenylene oxide) composite as an embedded magnetic core

He, Xuemei, Chen, Yuanming, Wang, Shouxu, He, Wei, Wang, Chong, Zhang, Huaiwu, Li, Qinghua, Ai, Kehua

Журнал:

Composites Part B: Engineering

Рік:

2018

Мова:

english

Файл:

PDF, 2.14 MB

english, 2018

Mechanism analysis of microvia filling based on multiphysics coupling

Ji, Linxian, Su, Shidong, Nie, Hexian, Wang, Shouxu, He, Wei, Ai, Kehua, Li, Qinghua

Журнал:

Circuit World

Рік:

2018

Мова:

english

Файл:

PDF, 473 KB

english, 2018

Electrochemical Factors of Levelers on Plating Uniformity of Through-Holes: Simulation and Experiments

Xiang, Jing, Wang, Shouxu, Li, Jing, He, Wei, Wang, Chong, Chen, Yuanming, Zhang, Huaiwu, Miao, Hua, Zhou, Jinqun, Jin, Xiaofeng

Журнал:

Journal of The Electrochemical Society

Рік:

2018

Мова:

english

Файл:

PDF, 976 KB

english, 2018

Copper induced direct CO2 laser drilling blind hole with the aid of brown oxidation for PCB CCL

Zhou, Guoyun, Li, Wenbin, Xiang, Qinying, He, Wei, Wang, Shouxu, Chen, Yuanming, Hong, Yan, Yang, Wenjun, Lai, Mingsheng, Chen, Shijin, Xu, Huan

Журнал:

Applied Surface Science

Рік:

2019

Файл:

PDF, 2.19 MB

2019

Nickel-nanoparticles-assisted direct copper-electroplating on polythiophene conductive polymers for PCB dielectric holes

Li, Jiujuan, Zhou, Guoyun, Wang, Jinzhong, Hong, Yan, He, Wei, Wang, Shouxu, Wang, Chong, Chen, Yuanming, Yang, Wenjun, Ma, Chaoying, Miao, Hua, Zhou, Jinqun, Chen, Qingguo

Журнал:

Journal of the Taiwan Institute of Chemical Engineers

Рік:

2019

Мова:

english

Файл:

PDF, 2.76 MB

english, 2019

Low fractal dimension modified drilling‐hole wall for PTFE high‐frequency board copper plating with plasma treatment

Zhou, Guoyun, Gou, Xueping, Jin, Xiaofeng, Wang, Shuai, He, Wei, Wang, Shouxu, Deng, Longjiang, Chen, Shijin, Liu, Gen

Журнал:

Journal of Applied Polymer Science

Рік:

2019

Мова:

english

Файл:

PDF, 2.58 MB

english, 2019

Solvent-dependent ultrasonic surface treatment on morphological reconstruction of CuO particles for copper electrodeposition

Chen, Yuanming, Yan, Dan, Jin, Xiaofeng, Yi, Zeng, Zhang, Dongming, Liu, Zhe, He, Wei, Wang, Shouxu, Wang, Zhi, Liu, Yaqing, Zhang, Weihua, Huang, Yunzhong

Журнал:

Applied Surface Science

Рік:

2019

Файл:

PDF, 9.37 MB

2019

Label Free Diagnosis for Colorectal Cancer through Coffee Ring Assisted Surface Enhanced Raman Spectroscopy on Blood Serum

Hong, Yan, Li, Yongqiang, Huang, Libin, He, Wei, Wang, Shouxu, Wang, Chong, Zhou, Guoyun, Chen, Yuanming, Zhou, Xin, Huang, Yifeng, Huang, Wen, Gong, Tianxun, Zhou, Zongguang

Журнал:

Journal of Biophotonics

Рік:

2020

Файл:

PDF, 1.66 MB

2020

Template-based synthesis of Ni nanorods on silicon substrate

Xiaoyun Jin, Yan Hu, Yao Wang, Ruiqi Shen, Yinghua Ye, Lizhi Wu, Shouxu Wang

Журнал:

Applied Surface Science

Рік:

2012

Мова:

english

Файл:

PDF, 1.25 MB

english, 2012

An investigation into the fabrication and combustion performance of porous silicon nanoenergetic array chips

Wang, Shouxu, Shen, Ruiqi, Ye, Yinghua, Hu, Yan

Журнал:

Nanotechnology

Рік:

2012

Мова:

english

Файл:

PDF, 1.16 MB

english, 2012

Synthesis and characterization of Ag nanorods used for formulating high-performance conducting silver ink

Yang, Xiaojian, He, Wei, Wang, Shouxu, Zhou, Guoyun, Tang, Yao

Журнал:

Journal of Experimental Nanoscience

Рік:

2014

Мова:

english

Файл:

PDF, 1.27 MB

english, 2014

Fabrication, characterization, and application in nanoenergetic materials of uncracked nano porous silicon thick films

Wang, Shouxu, Shen, Ruiqi, Yang, Cheng, Ye, Yinghua, Hu, Yan, Li, Chuangxin

Журнал:

Applied Surface Science

Рік:

2013

Мова:

english

Файл:

PDF, 1.48 MB

english, 2013

Space-Time based on content-based pub/sub in Delay Tolerance Networks

Jing Wang, Zhijun Li, Yan Zhang, Shouxu Jiang

Журнал:

Procedia Engineering

Рік:

2011

Мова:

english

Файл:

PDF, 476 KB

english, 2011

Preparation of High-Performance Conductive Ink with Silver Nanoparticles and Nanoplates for Fabricating Conductive Films

Yang, Xiaojian, He, Wei, Wang, Shouxu, Zhou, Guoyun, Tang, Yao

Журнал:

Materials and Manufacturing Processes

Рік:

2012

Мова:

english

Файл:

PDF, 648 KB

english, 2012

Fabrication of a novel porous Ni–P thin-film using electroless-plating: Application to embedded thin-film resistor

Zhou, Guoyun, He, Wei, Wang, Shouxu, Chen, Chia-yun, Wong, Ching Ping

Журнал:

Materials Letters

Рік:

2013

Мова:

english

Файл:

PDF, 880 KB

english, 2013

Experimental investigation of thermal stratification in a pressurizer surge line

Qiao, Shouxu, Gu, Hongfang, Wang, Haijun, Luo, Yushan, Wang, Dasheng, Liu, Pan, Wang, Qingli, Mao, Qing

Журнал:

Annals of Nuclear Energy

Рік:

2014

Мова:

english

Файл:

PDF, 1.41 MB

english, 2014

Electrochemical Study of Cyproconazole as a Novel Corrosion Inhibitor for Copper in Acidic Solution

Tao, Zhihua, He, Wei, Wang, Shouxu, Zhou, Guoyun

Журнал:

Industrial & Engineering Chemistry Research

Рік:

2013

Мова:

english

Файл:

PDF, 2.19 MB

english, 2013

The superiority of silver nanoellipsoids synthesized via a new approach in suppressing the coffee-ring effect during drying and film formation processes

Tang, Yao, He, Wei, Wang, Shouxu, Tao, Zhihua, Cheng, Lijuan

Журнал:

Nanotechnology

Рік:

2014

Мова:

english

Файл:

PDF, 1.32 MB

english, 2014

Preparation and thermal effects of polyarylene ether nitrile aluminium nitride composites

Chen, Yuanming, He, Wei, Zhou, Guoyun, Hu, Yongsuan, Wang, Shouxu, Tao, Zhihua

Журнал:

Polymer International

Рік:

2014

Мова:

english

Файл:

PDF, 441 KB

english, 2014

[IEEE 2009 International Conference on Applied Superconductivity and Electromagnetic Devices (ASEMD) - Chengdu, China (2009.09.25-2009.09.27)] 2009 International Conference on Applied Superconductivity and Electromagnetic Devices - Preparation of ultra-fine copper powder and its application in manufacturing conductive lines by printed electronics technology

Yang, Ying, Wang, Shouxu, He, Wei, Hu, Ke, He, Bo, Mo, Yunqi

Рік:

2009

Мова:

english

Файл:

PDF, 411 KB

english, 2009

New insight into the size-controlled synthesis of silver nanoparticles and its superiority in room temperature sintering

Tang, Yao, He, Wei, Wang, Shouxu, Tao, Zhihua, Cheng, Lijuan

Журнал:

CrystEngComm

Рік:

2014

Мова:

english

Файл:

PDF, 5.17 MB

english, 2014

Properties and application of polyimide-based composites by blending surface functionalized boron nitride nanoplates

Chen, Yuanming, Gao, Xing, Wang, Jinling, He, Wei, Silberschmidt, Vadim V., Wang, Shouxu, Tao, Zhihua, Xu, Huan

Журнал:

Journal of Applied Polymer Science

Рік:

2015

Мова:

english

Файл:

PDF, 1.46 MB

english, 2015

Characterization and application of aggregated porous copper oxide flakes for cupric source of copper electrodeposition

Chen, Yuanming, Lin, Jianhui, Qiu, Tianyang, He, Wei, Silberschmidt, Vadim V., Wang, Shouxu, Tan, Ze

Журнал:

Materials Letters

Рік:

2015

Мова:

english

Файл:

PDF, 3.58 MB

english, 2015

Copper coin-embedded printed circuit board for heat dissipation: manufacture, thermal simulation and reliability

Chen, Yuanming, Wang, Shouxu, He, Xuemei, He, Wei, Silberschmidt, Vadim V., Tan, Ze

Журнал:

Circuit World

Рік:

2015

Мова:

english

Файл:

PDF, 400 KB

english, 2015

Multiphysics coupling simulation of RDE for PCB manufacturing

Ji, Linxian, Wang, Chong, Wang, Shouxu, He, Wei, Xiao, Dingjun, Tan, Ze

Журнал:

Circuit World

Рік:

2015

Мова:

english

Файл:

PDF, 1.22 MB

english, 2015

AIP Conference Proceedings [AIP 7TH INTERNATIONAL SYMPOSIUM ON MULTIPHASE FLOW, HEAT MASS TRANSFER AND ENERGY CONVERSION - Xi'an, Shaanxi Province, China (26–30 October 2012)] - Experimental study on boiling heat transfer and two-phase frictional pressure drop characteristics of glycol-water solution in a vertical porous surface tube

Qiao, Shouxu, Wang, Haijun, Gu, Hongfang, Luo, Yushan, Zhang, Lei, Xiong, Wei

Рік:

2013

Мова:

english

Файл:

PDF, 381 KB

english, 2013

AIP Conference Proceedings [AIP 7TH INTERNATIONAL SYMPOSIUM ON MULTIPHASE FLOW, HEAT MASS TRANSFER AND ENERGY CONVERSION - Xi'an, Shaanxi Province, China (26–30 October 2012)] - Experimental investigations on flow instabilities in a forced circulation loop at near-critical and supercritical pressures

Zhang, Lei, Wang, Haijun, Gu, Hongfang, Qiao, Shouxu, Shi, Xiaobao, Luo, Yushan

Рік:

2013

Мова:

english

Файл:

PDF, 490 KB

english, 2013

Triterpenoid Saponins from Androsace umbellata and their Anti-proliferative Activities in Human Hepatoma Cells

Wang, Ying, Zhang, Dongmei, Ye, Wencai, Yin, Zhiqi, Fung, Kwok-Pui, Zhao, Shouxue, Yao, Xinsheng

Журнал:

Planta Medica

Рік:

2008

Мова:

english

Файл:

PDF, 134 KB

english, 2008

SPIE Proceedings [SPIE 2nd International Symposium on Laser Interaction with Matter (LIMIS 2012) - Xi'an, Shaanxi, China (Sunday 9 September 2012)] 2nd International Symposium on Laser Interaction with Matter (LIMIS 2012) - Investigation on combustion of porous silicon nanoenergetic chips ignited by single pulse laser

Wang, Shouxu, Shen, Ruiqi, Ye, Yinghua, Hu, Yan, Wu, Lizhi, Yang, Cheng, Kaierle, Stefan, Liu, Jingru, Cao, Jianlin

Рік:

2013

Мова:

english

Файл:

PDF, 1.98 MB

english, 2013

[IEEE 2014 IEEE 12th International Conference on Dependable, Autonomic and Secure Computing (DASC) - Dalian, China (2014.8.24-2014.8.27)] 2014 IEEE 12th International Conference on Dependable, Autonomic and Secure Computing - Distributed Energy-Efficient Power Control Algorithm of Delay Constrained Traffic over Multi Fading Channels

Wang, Shuai, Li, Zhijun, Jiang, Shouxu

Рік:

2014

Мова:

english

Файл:

PDF, 375 KB

english, 2014

[IEEE 2016 China Semiconductor Technology International Conference (CSTIC) - Shanghai, China (2016.3.13-2016.3.14)] 2016 China Semiconductor Technology International Conference (CSTIC) - Directly electroless-plating NI-P thin-film to fabricate magnetic core of integrated inductor for printed circuit board

Zhou, Guoyun, Xu, Xiaolan, Yang, Ting, He, Wei, Wang, Shouxu, Chen, Yuanming, Yang, Wenjun

Рік:

2016

Мова:

english

Файл:

PDF, 471 KB

english, 2016

Multi-physics coupling aid uniformity improvement in pattern plating

Ji, Linxian, Wang, Chong, Wang, Shouxu, Zhu, Kai, He, Wei, Xiao, Dingjun

Журнал:

Circuit World

Рік:

2016

Мова:

english

Файл:

PDF, 407 KB

english, 2016